The University of Washington – Washington Nanofabrication Facility (UW WNF) is a national user facility that is a part of the National Nanotechnology Infrastructure Network (NNIN). Located on the University of Washington, Seattle campus, UW WNF is a full service micro and nanotechnology user facility and is the largest public access fabrication center in the Pacific Northwest, with 15,000sf of laboratories, cleanrooms, and user spaces focused on enabling basic and applied research, advanced research and development, and prototype production.
A premier research laboratory in the College of Engineering, the Carnegie Mellon Nanofabrication Facility is one of the most well equipped university based facilities for thin film and nano/micro device development in the United States. The Nanofab includes a cleanroom with 2,600 square feet of class 100 space and 1,200 square feet of class 10 space, as well as three thin film labs.
The Stanford Nanofabrication Facility serves academic, industrial, and governmental researchers across the U.S. and around the globe. More than a lab, it's a vibrant research community. We are supported by NSF through the National Nanotechnology Infrastructure Network.
Open to both Boston College and External Users, this laboratory is home to over 30 high-end micro and nanoscale instrumentation systems worth several million dollars.
Comprised of 1,500 square feet of Class 1,000 and Class 10,000 cleanroom spaces, the lab enables highly sensitive materials and devices to be fabricated free from contaminants. In addition, there is over 2,000 square feet of service and support space. The lab is supported by an air handling unit that completely cleans and renews all the air in the facility every 45 seconds.
The Utah Nanofab encompasses a class 100/1000/10,000 cleanroom, packaging, and test areas. Commissioned in 2012, the new 18,000 square foot facility provides the specialized custom-built infrastructure, equipment, processes, and expertise necessary for researchers and companies to design, build, and package revolutionary micro and nanoscale devices. Capabilities include device modeling, design layout, mask fabrication, thin film deposition, patterning, and device packaging.